SMT
BGA
Through-Hole
and
Mixed
Technologies |
Avantec's Manufacturing Services
Avantec offers its customers surface mount (SMT), ball grid array (BGA), through-hole, or mixed technology services to satisfy every requirement. Our surface mount line consists of automatic pick-and-place equipment from Philips* and Amistar. All through-hole assemblies are soldered using the Electrovert Econopack Wave Soldering System. All fluxes used in our assembly processes are water soluble, allowing all products to pass through various cleaning stages using the de-ionized aqueous water cleaning system.
|
Consignment
or
Full Turnkey |
Avantec offers both consignment and full turnkey arrangements to suit our customers requirement. Our MRP system controls purchasing and inventory on a first-in-first-out (FIFO) basis. All customer-owned components are stored in an on-site bonded stockroom.
|
Additional
Services |
Along with its main core business of high-quality PCB assembly, Avantec can also offer its customers:
Full Electro-Mechanical Box Builds
Prototyping
Cable and Harness Assembly
ICT / Functional Testing
Conformal Coating
|
* Fine Pitch, 12 mil Spacing, SMDs from 0402 passives to 54 x 54 mm QFPs |
